Description
LOCTITE® HY 4070™ Universal Bonder is designed for the assembly of parts with bond gaps up to 0.2 in (5 mm), and/or for applications where the complete cure of excess adhesive is a must. The gel consistency prevents adhesive flow even on vertical surfaces. HY 4070 is ideally suited for applications where temperature and moisture resistance is required. Best application results are achieved with use of the LOCTITE cyanoacrylate mixing nozzle (contained in the 11 gram kit).
- Fast fixturing
- Moisture resistant
- Temperature resistance from -40 to +100°C
- Gap filling up to 0.2 in (5 mm)
- Gel consistency prevents adhesive flow, even on vertical surfaces.
- Excellent bonding characteristics to a variety of substrates including plastics, rubbers, and metals
